Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for cleaning wire bonding machines using functionalized surface microfeatures

System and method for cleaning wire bonding machines using functionalized surface microfeatures

US Patent 11318550 · Granted May 3, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pick and place machine cleaning system and method2023
Pick and place machine cleaning system and method2023
Pick and place machine cleaning system and method2023
Pick and place machine cleaning system and method2023
Material and hardware to automatically clean flexible electronic web rolls2022
System and method for cleaning contact elements and support hardware using funct2021
System and method for cleaning contact elements and support hardware using funct2021
System and method for cleaning contact elements and support hardware using funct2021
System and method for cleaning contact elements and support hardware using funct2021
Material and hardware to automatically clean flexible electronic web rolls2021
Device and method for thermal stabilization of probe elements using a heat condu2021
Device and method for thermal stabilization of probe elements using a heat condu2021