Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder preform for establishing a diffusion solder connection and method for producing a solder preform

Solder preform for establishing a diffusion solder connection and method for producing a solder preform

US Patent 11285568 · Granted Mar 29, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semifinished product for populating with components and, method for populating s2025
Semifinished product for populating with components and, method for populating s2025
Vibration-damped circuit arrangement, converter, and aircraft having such an arr2023
Vibration-damped circuit arrangement, converter, and aircraft having such an arr2023
Method for mounting an electrical component in which a hood is used, and a hood 2022
Capacitor structure and power module having a power electronic component2022
Capacitor structure and power module having a power electronic component2022
Power module having a power electronics device on a substrate board, and power e2022
Power module having a power electronics device on a substrate board, and power e2022
Solder alloy for power devices and solder joint having a high current density2022
Soldering material based on Sn Ag and Cu2022
Semiconductor component and method for producing same2022