Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires

Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires

US Patent 11257780 · Granted Feb 22, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Manufacturing method of flip chip package structure2025
Semiconductor package having improved thermal interface between semiconductor di2024
Flip chip package structure and manufacturing method thereof2024
Semiconductor package with EMI shielding structure2024
Semiconductor package having improved thermal interface between semiconductor di2023
Semiconductor package with EMI shielding structure2022
Semiconductor package having improved thermal interface between semiconductor di2022
Semiconductor package and fabrication method thereof2022
Semiconductor package having improved thermal interface between semiconductor di2022
Semiconductor package having multi-tier bonding wires and components directly mo2020
Semiconductor chip package with resilient conductive paste post and fabrication 2020
Method for fabricating a semiconductor package2019