Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stack structures in electronic devices including passivation layers for distributing compressive force

Stack structures in electronic devices including passivation layers for distributing compressive force

US Patent 11257774 · Granted Feb 22, 2022

Estimated economic value: $25,693,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Moisture barrier for metal insulator metal capacitors and integrated circuit hav2025
Moisture barrier for bond pads and integrated circuit having the same2023
Devices and methods related to stack structures including passivation layers for2023
Devices and methods related to stack structures including passivation layers for2023
Hybrid acoustic LC filter cascaded with LC filter2022
Method of making moisture barrier for bond pads and integrated circuit having th2022
Wafer level chip scale filter packaging using semiconductor wafers with through 2022
Moisture barrier for bond pads and integrated circuit having the same2022
Device packaging using a recyclable carrier substrate2021
Cascaded filter circuit with hybrid acoustic LC filter2021
Discharge circuits, devices and methods2020
Device packaging using a recyclable carrier substrate2020