Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)

Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)

US Patent 11257729 · Granted Feb 22, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming hybrid substrate with uniform thickne2025
Semiconductor device and method of forming microelectromechanical systems (MEMS)2025
Package structure and method for forming same2025
SIP package structure2025
Fan-out package structure and method for manufacturing the same2024
Split RDL connection between die and UBM2024
Semiconductor device with encapsulant deposited along sides and surface edge of 2024
Semiconductor device with encapsulant deposited along sides and surface edge of 2024
Antenna in embedded wafer-level ball-grid array package2024
PUF-based IoT device using channel state information, and authentication method 2024
Semiconductor device and method to minimize stress on stack via2024
Integrated package structure2024