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Home › Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

US Patent 11233014 · Granted Jan 25, 2022

Estimated economic value: $53,132,000 ⓘ

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