Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated assemblies having void regions between digit lines and conductive structures, and methods of forming integrated assemblies

Integrated assemblies having void regions between digit lines and conductive structures, and methods of forming integrated assemblies

US Patent 11195560 · Granted Dec 7, 2021

Estimated economic value: $25,164,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Word line drivers for multiple-die memory devices2025
Microelectronic devices and memory devices2025
Apparatuses including insulative structures of stack structures having different2025
Memory devices and related electronic systems2025
Memory arrays with vertical transistors and the formation thereof2025
Microelectronic devices, related electronic systems, and methods of forming micr2025
Event-based secured data access authorization system2025
Microelectronic devices, related electronic systems, and methods of forming micr2025
Microelectronic devices, related electronic systems, and methods of forming micr2025
Methods of forming microelectronic devices, and related microelectronic devices 2025
Integrated assemblies and methods of forming integrated assemblies2025
Dual function energy-storing supercapacitor-based carbon fiber composite for bod2025