Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same

Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same

US Patent 11177887 · Granted Nov 16, 2021

Estimated economic value: $2,236,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing semiconductor package structure2025
Techniques for thermal management within optical subassembly modules2025
Techniques for thermal management within optical subassembly modules2025
Optical transceiver housing with integrated vapor chamber and an optical transce2024
Fiber holder for use with optical subassembly modules2023
Techniques for thermal management within optical subassembly modules and a heate2023
Method and an apparatus for detecting a magnetic field2022
Parabolic lens device for use in optical subassembly modules2022
Component bridge for increasing mounting surface area on feedthrough device and 2022
Systems and methods for generating search queries using toggle buttons associate2022
Optical demultiplexer with truncated profile and an optical transceiver module i2022
Locking arrangements for pluggable optical subassembly modules2022