Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Techniques for thermal management within optical subassembly modules and a heater device for laser diode temperature control

Techniques for thermal management within optical subassembly modules and a heater device for laser diode temperature control

US Patent 11682878 · Granted Jun 20, 2023

Estimated economic value: $3,012,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Techniques for thermal management within optical subassembly modules2025
Techniques for thermal management within optical subassembly modules2025
Method and system for tracking events in distributed high-throughput application2025
Optical transceiver housing with integrated vapor chamber and an optical transce2024
Fiber holder for use with optical subassembly modules2023
Multi-functional travel charger and control system thereof2023
Parabolic lens device for use in optical subassembly modules2022
Parabolic lens device for use in optical subassembly modules2022
Method and system for tracking events in distributed high-throughput application2022
Component bridge for increasing mounting surface area on feedthrough device and 2022
Optical demultiplexer with truncated profile and an optical transceiver module i2022
Optical demultiplexer with truncated profile and an optical transceiver module i2022