Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › 3D integrated ultra high-bandwidth multi-stacked memory

3D integrated ultra high-bandwidth multi-stacked memory

US Patent 11152343 · Granted Oct 19, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Doped polar layers and semiconductor device incorporating same2025
Asynchronous carry-ripple adder with majority or minority gates2025
Asynchronous carry-ripple adder with majority or minority gates2025
Asynchronous carry-ripple adder with majority or minority gates2025
Perovskite-based magnetoelectric spin-orbit logic devices2025
Integrating embedded memory with logic interconnects2025
Integrating embedded memory with logic interconnects2025
Method of forming capacitors through wafer bonding2025
Method of forming capacitors through wafer bonding2025
Method of forming capacitors through wafer bonding2025
High-density low voltage non-volatile memory with unidirectional plate-line and 2025
High-density low voltage non-volatile memory with unidirectional plate-line and 2025