Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductive bonding layer with spacers between a package substrate and chip

Conductive bonding layer with spacers between a package substrate and chip

US Patent 11145575 · Granted Oct 12, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for controlling a memory system, a memory system, and an electronic devic2025
Read offset compensation in read operation of memory device2025
Memory systems and methods of operating thereof, memory controllers and readable2025
Decoder, decoding method, memory controller, and memory system2025
Memory controller and memory system performing wear-leveling2025
Media scan in memory systems2025
Memory system and method of operating thereof, and computer-readable storage med2025
Memory system controller, memory and operation methods thereof, and electronic d2025
Error correction method, memory system and memory controller2025
Sample manipulation and assay with rapid temperature change2025
Semiconductor wafer and semiconductor dies formed therefrom including grooves al2025
Dynamic voltage supply for memory circuit2025