Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package

Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package

US Patent 11088060 · Granted Aug 10, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package including post2025
Semiconductor device and semiconductor package having the same2024
Semiconductor device and semiconductor package having the same2024
Film structure, element, and multilevel element2024
Semiconductor package including post2024
Fan-out semiconductor package2023
Fan-out semiconductor package2023
Semiconductor device and semiconductor package having the same2023
Semiconductor device and semiconductor package having the same2023
Fan-out semiconductor package2021
Fan-out semiconductor package2021
Semiconductor device and method of forming ultra thin multi-die face-to-face WLC2020