Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Modular microjet cooling of packaged electronic components

Modular microjet cooling of packaged electronic components

US Patent 11018077 · Granted May 25, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Actively cooled heat-dissipation lids for computer processors and processor asse2025
Conformal cooling assembly with substrate fluid-proofing for multi-die electroni2025
Liquid-in-liquid cooling system for electronic components2025
Liquid-in-liquid cooling system for electronic components2025
High temperature electronic device thermal management system2025
Thermal management of electronics using co-located microjet nozzles and electron2024
Flow-through, hot-spot-targeting immersion cooling assembly2024
Actively cooled heat-dissipation lids for computer processors and assemblies2024
High temperature electronic device thermal management system2024
Direct contact fluid based cooling module2023
Modular microjet cooling of packaged electronic components2023
Modular microjet cooling of packaged electronic components2023