Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Liquid-in-liquid cooling system for electronic components

Liquid-in-liquid cooling system for electronic components

US Patent 12289861 · Granted Apr 29, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Actively cooled heat-dissipation lids for computer processors and processor asse2025
Actively cooled heat-dissipation lids for computer processors and processor asse2025
Conformal cooling assembly with substrate fluid-proofing for multi-die electroni2025
Conformal cooling assembly with substrate fluid-proofing for multi-die electroni2025
High temperature electronic device thermal management system2025
High temperature electronic device thermal management system2025
Thermal management of electronics using co-located microjet nozzles and electron2024
Thermal management of electronics using co-located microjet nozzles and electron2024
Flow-through, hot-spot-targeting immersion cooling assembly2024
Flow-through, hot-spot-targeting immersion cooling assembly2024
Actively cooled heat-dissipation lids for computer processors and assemblies2024
Actively cooled heat-dissipation lids for computer processors and assemblies2024