Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having overlapping electrically conductive regions and method for producing the same

Semiconductor package having overlapping electrically conductive regions and method for producing the same

US Patent 11018072 · Granted May 25, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor module with external power sensor2025
Double-sided coolable semiconductor package2025
Double-sided coolable semiconductor package2025
Double-sided coolable semiconductor package2025
Fluid-cooled package having shielding layer2024
Power semiconductor module and method for fabricating the same2023
Double sided semiconductor package2022
Double sided semiconductor package2022
Double sided semiconductor package2022
Sensor devices with sensor chip and busbar2022
Semiconductor package and method for fabricating a semiconductor package2022
Sensor devices having a sensor chip and busbar2022