Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer

Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer

US Patent 10959338 · Granted Mar 23, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stiffener device for an M.2 type connector2025
Electronic board having components in cavities and shared solder pads and manufa2023
Electronic board having components in cavities and shared solder pads and manufa2023
Electronic board comprising SMDS soldered on buried solder pads2022
Electronic board comprising SMDS soldered on buried solder pads2022
Removal of high stress zones in electronic assemblies2021
Removal of high stress zones in electronic assemblies2021