Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431643 | Stiffener device for an M.2 type connector | Pascal Guyot, Martial Chantre, Vincent Prevost | 2025-09-30 |
| 11770899 | Electronic board having components in cavities and shared solder pads and manufacturing method for the same | Philippe Chocteau | 2023-09-26 |
| 11284519 | Electronic board comprising SMDS soldered on buried solder pads | Philippe Chocteau | 2022-03-22 |
| 10959338 | Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer | Philippe Chocteau, Jacky Jouan | 2021-03-23 |
| 10952314 | Removal of high stress zones in electronic assemblies | Philippe Chocteau | 2021-03-16 |