{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Triblock copolymers for self-aligning vias or contacts", "item": "https://www.patentleaderboard.com/patent/10950501"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Triblock copolymers for self-aligning vias or contacts

Triblock copolymers for self-aligning vias or contacts

US Patent 10950501 · Granted Mar 16, 2021

Estimated economic value: $38,556,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-assembled guided hole and via patterning over grating2025
Subtractively patterned interconnect structures for integrated circuits2025
Integrated circuit structure with filled recesses2025
Contact over active gate structures with conductive trench contact taps for adva2025
Bottom-up fill dielectric materials for semiconductor structure fabrication and 2025
Directed self-assembly enabled subtractive metal patterning2025
Directed self-assembly enabled patterning over metal layers using assisting feat2025
Diamondoid materials in quantum computing devices2025
Contact over active gate structures using directed self-assembly for advanced in2025
Self-assembled guided hole and via patterning over grating2025
Advanced lithography and self-assembled devices2025
Self aligned gratings for tight pitch interconnects and methods of fabrication2024