Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging method and package structure of wafer-level system-in-package

Packaging method and package structure of wafer-level system-in-package

US Patent 10930617 · Granted Feb 23, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Air gap type semiconductor device package structure2024
Fingerprint identification module, method for forming fingerprint identification2024
Air gap type semiconductor device package structure and fabrication method there2023
Mask plate and fabrication method thereof2022
Image capturing assembly, lens module and electronic device2022
Package structure of wafer-level system-in-package2022
Image capturing assembly and packaging method thereof, lens module, and electron2022
Camera assembly and packaging method thereof, lens module, electronic device2021
Camera assembly and packaging method thereof, lens module, and electronic device2021
Alignment mark and semiconductor device, and fabrication methods thereof2021
Camera assembly and packaging methods thereof, lens module, and electronic devic2021
Packaging method and package structure of wafer-level system-in-package2020