Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Layered boundary interconnect

Layered boundary interconnect

US Patent 10929331 · Granted Feb 23, 2021

Estimated economic value: $131,479,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Unified programmable computational memory and configuration network2021
Multi-rank high bandwidth memory (HBM) memory2021
Configuring programmable logic region via programmable network2021
Integrating rows of input/output blocks with memory controllers in a columnar pr2021
Standalone interface for stacked silicon interconnect (SSI) technology integrati2020
Boundary logic interface2020
Unified programmable computational memory and configuration network2020
Auto address generation for switch network2020
Test network for a network on a chip and a configuration network2019
Heterogeneous ball pattern package2019
Circuit for and method of implementing a scan chain in programmable resources of2018
High bandwidth memory (HBM) bandwidth aggregation switch2018