Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Image sensor flip chip package

Image sensor flip chip package

US Patent 10903255 · Granted Jan 26, 2021

Estimated economic value: $51,901,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Controllable gap height for an image sensor package2024
Packaging structure for a sensor having a sealing layer2023
Molded image sensor chip scale packages and related methods2022
Image sensor semiconductor packages and related methods2022
Controllable gap height for an image sensor package2022
Embedded image sensor semiconductor packages and related methods2021
System, structure, and method of manufacturing a semiconductor substrate stack2021
Molded image sensor chip scale packages and related methods2021
Packaging structure for a sensor having a sealing layer2020
Embedded image sensor semiconductor packages and related methods2020
Embedded image sensor semiconductor packages and related methods2020
System, structure, and method of manufacturing a semiconductor substrate stack2019