Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bump structures for high density flip chip interconnection

Bump structures for high density flip chip interconnection

US Patent 10879204 · Granted Dec 29, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Time centered high-dynamic-range readout2025
Sensor with upconversion layer2025
Wellbore tractor including a tractor power receive module2025
Expandable element assembly with external rigid support element to isolate well 2025
5G NR FR2 beam management enhancements2025
LDMOS device having isolation regions comprising DTI regions extending from a bo2025
Fluid holdup monitoring in downhole fluid sampling tools2025
Cross carrier scheduling with different sub-carrier spacing capability reporting2025
Pulsed-power drilling system with integrated power and communication coiled tubi2025
Sea floor automatic well intervention2025
Three-dimensional inversion of multi-component electromagnetic measurements usin2025
Adaptive control electromagnetic induction energy harvesting method and system f2025