Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit mounting structure and lead frame for system in package (SIP) devices

Circuit mounting structure and lead frame for system in package (SIP) devices

US Patent 10867979 · Granted Dec 15, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System in a package modifications2025
Secure enclave system-in-package2024
System in a package modifications2024
High performance module for SiP2023
High performance module for SiP2023
System and method of assembling a system2022
System and method of assembling a system2022
Analog memory cells with valid flag2022
Analog arithmetic unit2022
Mixed signal computer architecture2022
EMI shield for molded packages2022
EMI shield for molded packages2022