Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Encapsulated semiconductor package

Encapsulated semiconductor package

US Patent 10811277 · Granted Oct 20, 2020

Estimated economic value: $24,093,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photonic glass layer substrate with embedded optical structures for communicatin2025
Method for collective dishing of singulated dies2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Semiconductor package with routing patch and method of fabricating the semicondu2025
Methods for fabrication of optical structures on photonic glass layer substrates2025
Semiconductor device with tiered pillar and manufacturing method thereof2024
Semiconductor package with front side and back side redistribution structures an2024
Semiconductor package with front side and back side redistribution structures an2024
Semiconductor device package and manufacturing method thereof2024
Semiconductor device package and manufacturing method thereof2024
Hybrid panel method of manufacturing electronic devices and electronic devices m2024
Semiconductor package with routing patch and conductive interconnection structur2024