Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including buried insulation layer and manufacturing method thereof

Semiconductor device including buried insulation layer and manufacturing method thereof

US Patent 10763170 · Granted Sep 1, 2020

Estimated economic value: $508,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bonded semiconductor structure and method for forming the same2025
Bonded semiconductor structure and method for forming the same2025
Method for fabricating inductor module2025
Method for fabricating inductor module2025
Semiconductor device and manufacturing method thereof2025
Semiconductor device and manufacturing method thereof2025
Method of forming protective layer utilized in silicon remove process2025
Method of forming protective layer utilized in silicon remove process2025
Integrated circuit device2025
Method of fabricating an air gap2025
Method of fabricating an air gap2025
Multi-finger transistor structure and method of manufacturing the same2025