Bond-free interconnect between a microcircuit housing and a printed circuit assembly

Assignee

• Keysight Technologies

Inventors

• Michael John Harriman (3 patents)
• Ryan Michael Avella (2 patents)
• Leonard M. Weber (7 patents)
• Brian R. Hutchison (4 patents)
• Naveed Edalati (3 patents)
• David Massie (3 patents)
• Rodrik Jon Lund (1 patents)
• Connie Van Schaick (1 patents)

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