Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Current-induced dark layer formation for metallization in electronic devices

Current-induced dark layer formation for metallization in electronic devices

US Patent 10739879 · Granted Aug 11, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Corrosion-resistant glass melt electrodes and methods of using them2023
Copper-alloy capping layers for metallization in touch-panel displays2023
Electronic devices having bilayer capping layers and/or barrier layers2023
Electronic devices having bilayer capping layers and/or barrier layers2023
Electronic devices having bilayer capping layers and/or barrier layers2023
Fabrication of reinforced superconducting wires2022
Copper-alloy capping layers for metallization in touch-panel displays2022
Current-induced dark layer formation for metallization in electronic devices2022
Current-induced dark layer formation for metallization in electronic devices2022
Current-induced dark layer formation for metallization in electronic devices2022
Sputtering targets and devices including Mo, Nb, and Ta, and methods2022
Electronic devices having bilayer capping layers and/or barrier layers2022