Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11814312 | Corrosion-resistant glass melt electrodes and methods of using them | Paul R. Aimone, Wendi LIU, Maria Bozena Winnicka | 2023-11-14 |
| 11640222 | Copper-alloy capping layers for metallization in touch-panel displays | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2023-05-02 |
| 11599210 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2023-03-07 |
| 11417445 | Fabrication of reinforced superconducting wires | Paul R. Aimone, David B. Smathers | 2022-08-16 |
| 11392257 | Copper-alloy capping layers for metallization in touch-panel displays | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2022-07-19 |
| 11327587 | Current-induced dark layer formation for metallization in electronic devices | Helia Jalili, Barbara Cox | 2022-05-10 |
| 11281317 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2022-03-22 |
| 11123029 | Method for producing a grid-like beam collimator, grid-like beam collimator comprising a grid structure having metal particles and a cured stiffening material, radiation detector, and medical imaging device | Andreas Freund, Harald Geyer, Stefan Wirth, Guido Stiebritz, Thomas Studnitzky +2 more | 2021-09-21 |
| 10916569 | Thin-film transistor and method of forming an electrode of a thin-film transistor | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2021-02-09 |
| 10877582 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2020-12-29 |
| 10739879 | Current-induced dark layer formation for metallization in electronic devices | Helia Jalili, Barbara Cox | 2020-08-11 |
| 10679775 | Fabrication of reinforced superconducting wires | Paul R. Aimone, David B. Smathers | 2020-06-09 |
| 10604434 | Corrosion-resistant glass melt electrodes and methods of using them | Paul R. Aimone, Wendi LIU, Maria Bozena Winnicka | 2020-03-31 |
| 10558284 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2020-02-11 |
| 10401994 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2019-09-03 |
| 10049793 | Fabrication of reinforced superconducting wires | Paul R. Aimone, David B. Smathers | 2018-08-14 |
| 9929187 | Copper-alloy capping layers for metallization in touch-panel displays | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2018-03-27 |
| 9412568 | Large-area sputtering targets | Mark Gaydos, William Loewenthal, Steven A. Miller, Gary Alan Rozak, Scott Jeffrey Volchko +2 more | 2016-08-09 |
| 9299472 | Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2016-03-29 |
| 8703233 | Methods of manufacturing large-area sputtering targets by cold spray | Steven A. Miller, Mark E. Gaydos, Gary Alan Rozak | 2014-04-22 |
| 6551375 | Ammunition using non-toxic metals and binders | David R. Siddle, Joseph M. Tauber | 2003-04-22 |