Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member

Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member

US Patent 10734297 · Granted Aug 4, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bonded body, power module substrate, power module, method for manufacturing bond2025
Production method for copper/ceramic joined body, production method for insulate2024
Method of manufacturing bonded body for insulation circuit substrate board and b2024
Method for producing insulating circuit substrate with heat sink2023
Method of manufacturing power module substrate board and ceramic-copper bonded b2023
Shift-drum speed change operation mechanism2023
Method for producing bonded body, method for producing insulated circuit board, 2022
Drum-type transmission device2022
Insulated heat transfer substrate, thermoelectric conversion module, and method 2022
Insulated heat transfer substrate, thermoelectric conversion module, and method 2022
Bonded body, power module substrate, power module, method for manufacturing bond2022
Method of manufacturing insulating circuit board with heatsink2022