Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of applying thermal interface materials to board level shields

Methods of applying thermal interface materials to board level shields

US Patent 10687447 · Granted Jun 16, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Edging for materials2025
Thermally-conductive electromagnetic interference (EMI) absorbers with silicon c2025
Thermally-conductive electromagnetic interference (EMI) absorbers including alum2025
Systems of applying materials to components2024
Thermal management and/or EMI mitigation materials including coated fillers2024
Thermally-conductive electromagnetic interference (EMI) absorbers including alum2024
Methods for establishing thermal joints between heat spreaders or lids and heat 2023
Material having edging2023
Material having edge shape2023
Thermally-conductive electromagnetic interference (EMI) absorbers with silicon c2023
Methods for establishing thermal joints between heat spreaders or lids and heat 2023
Thermal interface materials including memory foam cores2022