Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic device with die being sunk in substrate

Electronic device with die being sunk in substrate

US Patent 10643940 · Granted May 5, 2020

Estimated economic value: $14,018,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

SMDs integration on QFN by 3D stacked solution2025
Semiconductor device with electrical component for bridging leadframe and chip m2025
Method of manufacturing semiconductor devices and corresponding device2025
Method of manufacturing semiconductor devices and corresponding semiconductor de2025
Method of manufacturing semiconductor devices and corresponding semiconductor de2024
Lead frame for a package for a semiconductor device, semiconductor device and pr2024
Semiconductor device and corresponding method of manufacture2024
Method of manufacturing semiconductor products, semiconductor product, device an2024
Semiconductor device and corresponding manufacturing method2024
SMDs integration on QFN by 3D stacked solution2023
Semiconductor device including electrical component connecting a semiconductor c2023
Assortment of substrates for semiconductor circuits, corresponding assortment of2023