Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Backplane footprint for high speed, high density electrical connectors

Backplane footprint for high speed, high density electrical connectors

US Patent 10638599 · Granted Apr 28, 2020

Estimated economic value: $112,701,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High speed connector2025
Backplane footprint for high speed, high density electrical connectors2025
Backplane footprint for high speed, high density electrical connectors2025
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2023
Backplane footprint for high speed, high density electrical connectors2021
Backplane footprint for high speed, high density electrical connectors2021
Backplane footprint for high speed, high density electrical connectors2021