Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300936 | High speed connector | Philip T. Stokoe, Thomas S. Cohen, Robert Richard, Donald W. Milbrand, Jr., Eric Leo +1 more | 2025-05-13 |
| 12207395 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2025-01-21 |
| 11805595 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2023-10-31 |
| 11765813 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2023-09-19 |
| 11553589 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2023-01-10 |
| 11096270 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2021-08-17 |
| 10993314 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2021-04-27 |
| 10638599 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2020-04-28 |
| 10485097 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2019-11-19 |
| 10201074 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2019-02-05 |
| 10187972 | Backplane footprint for high speed, high density electrical connectors | Marc Robert Charbonneau | 2019-01-22 |
| 9660384 | Electrical connector with hybrid shield | — | 2017-05-23 |
| 9004942 | Electrical connector with hybrid shield | — | 2015-04-14 |
| 8481866 | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards | Jason Edward Chan | 2013-07-09 |
| 7999192 | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards | Jason Edward Chan | 2011-08-16 |