Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonded laser with solder-free laser active stripe in facing relationship with submount

Bonded laser with solder-free laser active stripe in facing relationship with submount

US Patent 10608404 · Granted Mar 31, 2020

Estimated economic value: $43,991,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heatsinking in laser devices2025
Heatsinking in laser devices2025
Heatsinking in laser devices2025
Reinforced removable pluggable module pull tabs2024
Removable pluggable module pull tabs2022
Fiber array unit with unfinished endface2022
Reinforced removable pluggable module pull tabs2022
Photonic chip with an evanescent coupling interface2019
Slotted configuration for optimized placement of micro-components using adhesive2019
TSV compatible fiber array coupler for silicon photonics2018
Photonic chip with an evanescent coupling interface2018
Silicon photonic chip with through VIAS2018