Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package design providing reduced electromagnetic coupling between circuit components

Semiconductor package design providing reduced electromagnetic coupling between circuit components

US Patent 10573594 · Granted Feb 25, 2020

Estimated economic value: $12,566,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of fabricating substrates with thermal vias and sinter-bonded thermal di2025
Power amplifier modules including topside cooling interfaces and methods for the2025
Low-stress thermal interface2025
Power amplifier modules, systems, and substrates containing field trapper struct2025
Surface-mount amplifier devices2024
Thick-silver layer interface2024
Overmolded microelectronic packages containing knurled flanges and methods for t2024
Radio frequency packages containing multilevel power substrates and associated f2024
Thermal interface structures, electrical systems with thermal interface structur2024
Hybrid device assemblies and method of fabrication2024
Power amplifier modules including topside cooling interfaces and methods for the2024
Leadless power amplifier packages including topside termination interposer arran2024