Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › MEMS device formed by at least two bonded structural layers and manufacturing process thereof

MEMS device formed by at least two bonded structural layers and manufacturing process thereof

US Patent 10570009 · Granted Feb 25, 2020

Estimated economic value: $25,532,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process for manufacturing a combined microelectromechanical device and correspon2025
Hermetically sealed MEMS mirror and method of manufacture2024
Piezoelectric micromachined ultrasonic transducer2024
Process for manufacturing a micro-electro-mechanical device, and MEMS device2024
Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufact2024
Piezoelectric microelectromechanical resonator device and corresponding manufact2023
Semiconductor device for ambient sensing including a cavity and a mechanical fil2023
Process for manufacturing an optical microelectromechanical device having a tilt2023
Hermetically sealed MEMS mirror and method of manufacture2023
Cross-point memory and methods for fabrication of same2023
Semiconductor device for ambient sensing including a cavity and a mechanical fil2022
Method for manufacturing a thin filtering membrane and an acoustic transducer de2022