Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stackable via package and method

Stackable via package and method

US Patent 10548221 · Granted Jan 28, 2020

Estimated economic value: $17,459,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with tiered pillar and manufacturing method thereof2024
Stackable via package and method2024
Stackable via package and method2024
Stackable via package and method2024
Semiconductor product with interlocking metal-to-metal bonds and method for manu2024
Semiconductor device and manufacturing method thereof2024
Semiconductor device with transmissive layer and manufacturing method thereof2024
Semiconductor device with integrated heat distribution and manufacturing method 2024
Method of manufacturing an electronic device and electronic device manufactured 2023
Stackable via package and method2023
Stackable via package and method2023
Stackable via package and method2023