Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor

Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor

US Patent 10535635 · Granted Jan 14, 2020

Estimated economic value: $2,940,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure, semiconductor device and manufacturing method thereof2025
Package structure, semiconductor device and manufacturing method thereof2025
Self-aligned scheme for semiconductor device and method of forming the same2025
Pellicle membrane with improved properties2025
Optical assembly with coating and methods of use2025
Metal cut region location method2025
Devices with reduced capacitances2025
Semiconductor device including parallel configuration2025
Semiconductor device including parallel configuration2025
Semiconductor device with cell region2025
SOIC chip architecture2025
SOIC chip architecture2025