Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wireless interconnects on flexible cables between computing platforms

Wireless interconnects on flexible cables between computing platforms

US Patent 10498379 · Granted Dec 3, 2019

Estimated economic value: $19,496,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Contactless communication using a waveguide extending through a substrate core2025
Liquid cooling system leak detection improvements2025
Physical vapor deposition seeding for high aspect ratio vias in glass core techn2025
RF filters and multiplexers manufactured in the core of a package substrate usin2025
Compact surface transmission line waveguides with vertical ground planes2025
Back-side power delivery with glass support at the front2025
Dielectric film coating for through glass vias and plane surface roughness mitig2025
Package substrate with glass core having vertical power planes for improved powe2025
Semiconductor packages with antennas2025
Magnetic planar spiral and high aspect ratio inductors for power delivery in the2025
Glass substrates having signal shielding for use with semiconductor packages and2025