Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and related methods

Semiconductor package and related methods

US Patent 10396028 · Granted Aug 27, 2019

Estimated economic value: $16,180,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lighting apparatus2025
Semiconductor package electrical contacts and related methods2025
Substrate structures and methods of manufacture2025
Die sidewall coatings and related methods2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
High power module package structures2025
Fan-out wafer level packaging of semiconductor devices2025
Fan-out wafer level packaging of semiconductor devices2025
Semiconductor package stress balance structures and related methods2025