Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of etching microelectronic mechanical system features in a silicon wafer

Method of etching microelectronic mechanical system features in a silicon wafer

US Patent 10395940 · Granted Aug 27, 2019

Estimated economic value: $305,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Magnetic field sensor cell and array2025
Adaptive display system for viewer with sunglasses2025
Dynamic adjustment of prism for head mounted display using photochromatic materi2025
Stacked multi-frequency three-dimensional metasurface2025
Fuel cell bipolar plate design for reduced corrosion potential2025
Systems and methods for cooling electronic devices2025
Horizontal computer numerical control (CNC) machining device for crankshaft2025
Method of designing fluid flow field structure for fuel cell bipolar plate2025
Method of designing fluid flow field structure for fuel cell bipolar plate2025
Fuel cell having bipolar plates with multi-layered dehomogenized turing-pattern 2025
Power device embedded printed circuit board-cold plate assemblies with low inter2025
3D printed cold plates and methods for cooling power devices embedded in 3D prin2025