Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for making an apparatus with fluid-flow-through cooling of circuit boards

Process for making an apparatus with fluid-flow-through cooling of circuit boards

US Patent 10362713 · Granted Jul 23, 2019

Estimated economic value: $77,787,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enhanced composite live hinge2021
Phase-change material (PCM) embedded heat exchanger assembly for laser diode coo2021
Integrated multi-chamber heat exchanger2021
Integrated multi-chamber heat exchanger2020
Composite live hinge2020
Process for installing an insert for fluid-flow-through cooling of circuit board2020
Process for installing an insert for fluid-flow-through cooling of circuit board2020
Process for installing an insert for fluid-flow-through cooling of circuit board2020
Integrated multi-chamber heat exchanger2020
Integrated multi-chamber heat exchanger2019
Integrated multi-chamber heat exchanger2019
Method of producing a fine line 3D non-planar conforming circuit2018