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Home › Method for depositing high deposition rate, thick tetraethyl orthosilicate film with low compressive stress, high film stability and low shrinkage

Method for depositing high deposition rate, thick tetraethyl orthosilicate film with low compressive stress, high film stability and low shrinkage

US Patent 10358717 · Granted Jul 23, 2019

Estimated economic value: $38,444,000 ⓘ

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