Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride

Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride

US Patent 10344373 · Granted Jul 9, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sputtering target2021
Control system, relay device and control method2020
Control system, relay device and control method2017
Target formed of sintering-resistant material of high-melting point metal alloy,2017
Method for connecting magnetic substance target to backing plate, and magnetic s2017
Ni alloy sputtering target, Ni alloy thin film and Ni silicide film2016
Barrier film for semiconductor wiring, sintered compact sputtering target and me2015
High-purity Ni-V alloy target therefrom high-purity Ni-V alloy thin film and pro2014
Barrier film for flexible copper substrate and sputtering target for forming bar2012
Plated product having copper thin film formed thereon by electroless plating2012
Hafnium alloy target2012
Hafnium alloy target2012