Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level manufacturing method for embedding passive element in glass substrate

Wafer-level manufacturing method for embedding passive element in glass substrate

US Patent 10321577 · Granted Jun 11, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package interface with improved impedance continuity2023
Reflection-canceling package trace design2020
Micro three-dimensional shell resonator gyroscope2020
Foaming process for preparing wafer-level glass micro-cavities2014