Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756905 | Package interface with improved impedance continuity | Xike Liu, Xiangxiang Ye, Xin Wang | 2023-09-12 |
| 10685942 | Reflection-canceling package trace design | Xike Liu | 2020-06-16 |
| 10321577 | Wafer-level manufacturing method for embedding passive element in glass substrate | Jintang Shang | 2019-06-11 |