Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and semiconductor structure including a multilayer package substrate

Apparatus and semiconductor structure including a multilayer package substrate

US Patent 10236239 · Granted Mar 19, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Speaker box2020
Method for performing a search, and computer program product and user interface 2019
Grille structure2019
Semiconductor structure including a thermally conductive, electrically insulatin2018
Semiconductor structure having thermal backside core2018
Semiconductor structure having thermal backside core2016
Grille structure2016
Under dash speaker box2016
Speaker box2016
Passivation for group III-V semiconductor devices having a plated metal layer ov2015
Pseudomorphic high electron mobility transistor comprising doped low temperature2014
Method for preparing a palladium-gold alloy gas separation membrane system2014