Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication method of packaging substrate having embedded passive component

Fabrication method of packaging substrate having embedded passive component

US Patent 10219390 · Granted Feb 26, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transdermal patch2021
Method for fabricating packaging substrate with embedded semiconductor component2016
Method of fabricating packaging substrate having a passive element embedded ther2016
Packaging substrate having embedded passive component and fabrication method the2015
Package structure having embedded electronic component2015
Package structure having embedded electronic component and fabrication method th2014
Packaging substrate having a passive element embedded therein and method of fabr2014
Package structure2013
Packaging substrate with embedded semiconductor component and method for fabrica2012
Charge pump circuit2012
Circuit board structure2011
Structure with semiconductor chips embeded therein2010