Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making a sensor package with cooling feature

Method of making a sensor package with cooling feature

US Patent 10199519 · Granted Feb 5, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Monolithic multi-focus light source device2022
Method and system for loading resources2021
High density three-dimensional integrated capacitors2021
Systems and methods for producing flat surfaces in interconnect structures2020
Microelectronic elements with post-assembly planarization2020
Staged via formation from both sides of chip2019
Active chip on carrier or laminated chip having microelectronic element embedded2019
Systems and methods for producing flat surfaces in interconnect structures2019
High density three-dimensional integrated capacitors2018
Back side illumination image sensor with non-planar optical interface2018
Back side illumination image sensor with non-planar optical interface2018
Robust multi-layer wiring elements and assemblies with embedded microelectronic 2018