Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structure and method of forming

Interconnect structure and method of forming

US Patent 10177091 · Granted Jan 8, 2019

Estimated economic value: $16,909,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

MRAM structure with a T-shaped ferromagnetic layer2025
Back-end-of-line thin film resistor2025
MRAM bottom electrode contact with taper profile2025
Top via interconnect with airgap2025
MRAM device with octagon profile2025
Dual-damascene fav interconnects with dielectric plug2025
Top via containing random-access memory cross-bar array2025
Magneto-resistive random access memory with hemispherical top electrode2025
Magnetoresistive random-access memory (MRAM) with preserved underlying dielectri2025
Damascene MRAM device2025
MRAM top electrode structure with liner layer2025
Fabrication of embedded memory devices utilizing a self assembled monolayer2025